• (+86)13828798939 Mr.Tony Tang derui@sz-derui.com 中文English

    PCB Plating Line

    Process:

    Desmear/PTH、Panel Plating、Pattern Plating、Via Filling Plating、Gold/Nickel Plating、Immersion Nickel/Gold、Gold Finger

    Technical characteristics of line:

    1.Flexible and open programe.

    2.Pepperl + Fuchs WCS positioning system.

    3.Auto/Manual top racks.

    4.Thin panel frame support.

    5. Floating shield and push rods.

    6. Bottom eductor/Side eductor.

    7. Anode screen and up/down cathode shield.

    8. Auto drip try on transporter.

    9. Anode flightbar by transporter conveyed.

    10.Service platform on transporter.

    11.Auto loading/unloading.

    12. Cup type auto dosing system.

    13. Carbon treatment system for Copper plating.

    14.Whole plant enclosed.

    3499CC拉斯维加斯